Colordyne to sponsor Label & Package Printing Industry Day

Colordyne Technologies will sponsor Label & Package Printing Industry Day on Thursday, June 25, at Potawatomi Hotel and Casino in Milwaukee, WI, USA. The free event will take place from 10:30 AM to 5 PM.

The day-long seminar, co-sponsored by Colordyne, aims to educate attendees on the current trends affecting both the regional and global labeling and packaging sectors. Topics will include:

• State of Label Industry: International Trends, Opportunities and Best Practices
• Americas: What’s Hot in the Labels & Packaging Sector
• TLMI: Who We Are, Where We Are, and Why You Should Come Along
• End user discussion on market insights with Sprecher Brewing Co.

“Label & Package Printing Industry Day is an event that brings together converters and packaging suppliers from throughout the region to collaborate on ideas affecting our industry,” says Gary Falconbridge, President and CEO, Colordyne Technologies. “If you’re in the converting and packaging industries, Label & Package Printing Industry Day is definitely a must-attend event.”

Label & Package Printing Industry Day is free to attend. Following the seminar, later in the evening, attendees are encouraged to attend an optional networking event at Summerfest at the Henry Maier Festival Park, 200 N. Harbor Drive, on Milwaukee’s lakefront.